Cooler Master HTK-002 heat sink compound Thermal paste 4.5 W/m·K

SKU
HTK-002-U1-GP
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In stock
Only 3 left
0.8 °C/W, 550 volts/mil, 21.7 kV/mm
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.
SKU HTK-002-U1-GP
EAN 4719512002940
Specification
Features
TypeThermal paste
Thermal resistance0.8 °C/W
Thermal conductivity4.5 W/m·K
Product colourWhite
Specific gravity2.37 g/cm³
Packaging data
Package width102 mm
Package depth171 mm
Package height40 mm
Quantity per pack1 pc(s)
Technical details
Thermal resistance0.8 °C/W
Thermal conductivity4.5 W/m·K
Weight & dimensions
Package width102 mm
Package depth171 mm
Package height40 mm
Colour
Product colourWhite
Logistics data
Quantity per pack1 pc(s)
Manufacturer Cooler Master
In Stock Y