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Intel Xeon Gold 6137, 25M Cache, 3.9 GHz, 205 W TDP, FCLGA3647, f/ XL230k GEN10
Category: Processors
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Processor cores | 8 |
| Processor family | Intel Xeon Gold |
| Processor lithography | 14 nm |
| SKU | P08416-B21 |
| EAN | 0190017312316 |
| Manufacturer | HPE |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor base frequency | 3.9 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 25 MB |
| Processor model | 6137 |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Gold 6000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
|---|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Processor series | Intel Xeon Gold 6000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Number of UPI links | 3 |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® vPro™ Platform Eligibility | Yes |
| Other features | |
| Compatibility | XL230k GEN10 |