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Socket SP3, 16 cores, 32 threads, 2.4 GHz base clock, 3.4 GHz boost clock, 64 MB cache, 130 W TDP
Category: Processors
| Processor socket | Socket SP3 |
|---|---|
| Box | No |
| Processor cores | 16 |
| Processor family | AMD EPYC |
| SKU | 100-000001288 |
| EAN | 8592978558468 |
| Manufacturer | AMD |
| Availability | In Stock |
| Product Family | EPYC |
| Processor | |
|---|---|
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 120 W |
| Thermal Design Power (TDP) | 130 W |
| Processor cache | 64 MB |
| Processor model | 7303 |
| Processor threads | 32 |
| Processor boost frequency | 3.4 GHz |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 150 W |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 120 W |
| Thermal Design Power (TDP) | 130 W |
| Technical details | |
|---|---|
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 130 W |
| Market segment | Server |
| Configurable TDP-up | 150 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 130 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Processor special features | |
| Configurable TDP-up | 150 W |
| Packaging data | |
| Package type | Tray |